PCB Assembly – Verna, Goa

Aviatech Enterprises Pvt. Ltd. (AEPL), part of Crown Defence, has established a dedicated Printed Circuit Board Assembly (PCBA) facility at Plot No. S 80–81, Verna Industrial Estate, Goa. The facility expands the group’s electronics manufacturing infrastructure and complements its established defence engineering and MRO capabilities across aviation, marine and land systems.

The Verna unit is configured to support PCB assemblies ranging from 80 mm x 80 mm up to 460 mm x 460 mm, with board thickness capability from 0.4 mm to 8 mm and controlled edge clearance standards of 3–5 mm. The infrastructure is aligned to serve high-reliability electronics requirements across defence and select civil sectors.

Core Capabilities

Micro-Component Precision

The SMT line is micro-component ready, capable of handling chips as small as 0.4 mm. This enables the manufacture of high-density electronic assemblies that require precise placement accuracy beyond standard production environments.

Large Board Versatility

The synchronized production line supports PCB sizes up to 460 mm x 460 mm, allowing assembly of both compact electronic modules and larger industrial or aerospace control panels within defined dimensional parameters.

Advanced Component Handling

The facility specializes in high-complexity components including Micro-BGA, CSP (Chip Scale Package), QFN (Quad Flat No-leads) and ultra-fine pitch packages. Process control is configured to support reliable placement of such components in regulated environments.

Quality Assurance & Inspection

3D Solder Paste Inspection (SPI)

Pre-placement inspection ensures controlled solder paste deposition prior to component mounting.

PARMI Xceed Optima L – Full 3D AOI

The assembly line incorporates full 3D Automated Optical Inspection to validate solder joint integrity and detect defects not visible in conventional 2D inspection systems.

Traceability

The facility supports full component-level traceability, aligned with requirements typically associated with defence and regulated sectors, including ISO 13485-level project standards.

Integrated Infrastructure

In addition to the SMT assembly line, the Verna facility includes controlled environment testing infrastructure, RF shield and anechoic capability for airborne electronics validation, and a NABL (ISO 17025) accredited calibration laboratory supporting electro-technical and mechanical parameters.